Outlook Supplement - Flipbook - Page 11
Forecast
activity is being concentrated in
smaller areas, while the high current
distribution paths are becoming
longer and more intense. That
combination puts additional load on
the power-delivery network. Loss
mechanisms that were previously
absorbed in the margin begin to show
up in ways that affect temperature,
transient behavior, and long-term
stability.
These technical pressures do not
exist in isolation. The timing mismatch
between compute demand and electrical
infrastructure expansion is the root of
the industry’s need for higher efficiency.
AI processors are approaching multikilowatt power levels, AI compute
system racks are on a path to megawatt
power levels, and at the same time,
data-center operators face limits on
how much new capacity they can bring
online. In practice, this means the
power budget becomes a real boundary
condition for large-scale deployment.
It is these constraints that force the
industry to focus on shifting toward
architectural adjustments rather than
incremental tuning. More design
work is moving into device-package
co-optimization, supported by electrical-thermal-mechanical co-simulation.
Vertical delivery paths, performance
embedded passives with higher density,
and improved power-ground structures give designers more control over
current distribution and fast-load events.
These changes reflect a broader need
to rethink how power is moved and
stabilized within advanced packages.
The common theme is that power
delivery is now a central design element, not a secondary one. Teams that
recognize this and approach compute
performance, thermal behavior, and
PDN design as an integrated problem
will be in a stronger position. This will
be the trend for 2026, but the pace of
that progress will track directly with
how effectively these power-delivery
constraints are addressed.
www.semiconductordigest.com
Regionalization: The End of Global
Semiconductor Supply Chains?
continuous stakeholder communication,
and rapid response to disruptions.
With digital solutions delivering
BARRY O’DOWD, B a r r y
O’Dowd, Global Head
actionable insights and experts guiding
of Semiconductor
you every step of the way, you can stay
Development,
ahead of expected and ready for the
Kuehne+Nagel
unexpected. The market may be
The past few years have
constantly changing, but with the
been marked by constant
right partner, your semiconductor
disruptions, making
supply chain can stay strong,
unprecedented conditions
agile and future-ready.
and shifts in the semiconResilience in 2026 isn’t about
ductor industry the norm.
choosing regional or global,
While predicting what
it’s about mastering both. The
BARRY
O’DOWD
comes next is impossible,
winners will be those who can
one trend remains clear:
localize execution while staying
Regionalization is gaining even greater
globally connected.
momentum in 2026. This shift, although
not new, will accelerate as more fabs
AI-Driven Collaboration
are deployed and built, reshaping global and Smarter Decision
supply chains.
Making throughout the
As regionalization continues,
Supply Chain in 2026
semiconductor businesses are increasJOHN KIBARIAN, C E O , P D F
ingly focused on ensuring smooth and
Solutions
efficient regional logistics operations.
The burst of semiconYet international trade lanes remain
ductor manufacturing
vital. While activity undertaken within
capacity is welcome
the region is expected to increase, the
news for 2026 now
journey to a completely self-sustained
that 18 new fabs
regional supply chain will remain a long construction projects
one. Asia, in particular, will continue to got started in 2025.
play a significant role in supply chains
Meanwhile, AI pushes
worldwide. For example, it continues to
demand in cloud, data JOHN KIBARIAN
dominate back-end packaging activities
centers and at the edge
in origins such as Taiwan and Malaysia, as the industry evolves into the era
ensuring that global interdependence
of 3D. This is driving the path to $1T
in the semiconductor supply chain will
revenue before 2030. AI cloud and
persist for some time.
edge applications alone could repWithin this environment, not only is
resent 67% of the market.
access to a regional and global shipping
Optimism for this growth should
network vital, but also the ability to
be couched with caution. The viral
adapt focus and adjust routing quickly.
effect of added capacity, AI and 3D
Recent times have proven that agility
has created manufacturing and R&D
and resilience are more crucial than
challenges that must be addressed. An
ever. Semiconductor companies need
AI-based unified data and collaboration
a logistics partner with a robust global
infrastructure across the entire supply
reach to manage both local and interchain could do just that.
national flows. This requires a supply
Advances in AI-based 3D chiplet
chain built on smart planning, priority
and system design and manufacturing
handling at hubs to minimize delays, re- innovation are critical as the industry
al-time visibility, proactive monitoring,
moves toward complex hybrid packages.
Semiconductor Digest Supplement to January 2026
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