Outlook Supplement - Flipbook - Page 26
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
JUNE 2019
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
JULY 2019
Machine Learning
Enables a Virtual
Defect Pareto p. 18
Chip Manufacturing
Challenges for
Advanced Logic p. 16
100 Years of Vacuum
Innovation p. 23
A Statistical
Approach to
Improving Chip
Reliability p. 22
Process Control
Needs Are
Increasing p. 26
AUGUST/SEPTEMBER 2019
Differential Hall
Effect Metrology p. 14
Abating Potentially
Dangerous
Particles p. 18
EUV Lithography:
Two Part Special p. 22
High-Volume Atomic
Layer Processing p. 26
A HOLISTIC APPROACH TO
Materials and
Processing
PAGE 10
Clock Tree
Optimization p. 29
DTCO CMP Modeling
and Simulation p. 30
Applying 300mm
LEARNING TO 200MM PROCESSING PAGE 13
Years of
Progress
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
DRAM, NAND and
Emerging Memory
TECHNOLOGY TRENDS PAGE 10
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OCTOBER 2019
The History and
Future of DRAM
Architecture p. 14
Fan-Out Packaging
Growth p. 21
Pixel LED
Headlights p. 24
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
Nanoscale
Features
THROUGH ATOMIC LAYER
PROCESSING PAGE 9
2019 IEDM
Preview p. 28
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
NOVEMBER/DECEMBER 2019
Interconnect
Scaling p. 12
Source Materials in
Ion Implantation p. 16
Phase Shift
Profilometry for
WLP p. 21
JANUARY/FEBRUARY 2020
AI IN
SEMICONDUCTOR
MANUFACTURING
PAGE 7
Challenges of Harsh
New Materials and
Processes p. 26
Executive Viewpoints:
2020 Outlook p. 17
A 300mm Platform
for 2D-material Based
MOSFET Devices p. 21
The Need for IoT
Security At the Chip
Level p. 25
TRENDS IN 2020:
A LOOK AHEAD
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JULY 2020
APRIL/MAY 2020
MARCH 2020
Deep Learning
Wafer Level
Packaging Reaches
New Heights p. 13
AT THE EXTREME EDGE PAGE 9
Overcoming ALD
Limitations p. 17
Process Power
Steps Out from the
Shadows p. 21
VLSI Design
Optimization and
Validation p. 24
The Future of
Healthcare in a PostPandemic World p. 22
Unlocking
the Secrets
Process Power: The
New Lithography p. 25
OF YMTC’S 3D NAND FLASH PAGE 10
Qubits and Quantum
Circuits p. 31
Energetic Materials in
the Sub-fab p. 33
Redefining
Reliability p. 24
Epitaxy: An Epic
Growth p. 27
Artificial
Intelligence &
Machine Learning
in Semiconductor Manufacturing PAGE 16
Metrology Solutions
for Gate-All-Around
Transistors p. 24
How COVID-19 Is
Impacting the Memory
Industry p. 29
Fab Models
Built on AI
China’s Memory
Industry p. 18
Collaborative Knowledge Sharing PAGE 20
Five trends That Will
Shape the Future
Semiconductor Tech
Landscape p.33
Autonomous Driving
Forges Ahead P. 22
Status of the
Advanced Packaging
Industry p. 24
A View on the
Logic
Technology
Roadmap
PAGE 12
When Device Failure Is
Not an Option p. 38
NOVEMBER/DECEMBER 2020
OCTOBER 2020
MEMS Industry
Outlook p. 21
Low-power
Radar Chip Enables
Devices to Sense
Vital Signs p. 26
Semiconductor
Manufacturing
in the U.S. PAGE 16
Tips on Becoming
a Debugging
Wizard p. 28
Outlook for
2021: Executive
Viewpoints p. 22
LiDAR, the Autonomy
Enabler p. 29
The Future
of Electronic
Precursors p. 33
Powering the
Electrostatic Chuck
p. 35
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Maskless
Lithography for
M
Pre ICO
vie N W
In w e s t
sid Gu 2
e! id 02 0
e
ALE Cooling
and Particulate
Contamination
Challenges p. 20
AUGUST/SEPTEMBER 2020
HIGH VOLUME PRODUCTION PAGE 14
SE
Lithography with
DSA and ASD p. 14
JUNE 2020
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SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
MARCH 2021
JANUARY/FEBRURARY 2021
APRIL/MAY 2021
TSMC’s Technology
Roadmap p. 22
Trillion Dollar
Chip Industry
Forecast p. 11
Needed: A
Collaborative Approach
for Automotive
Electronics p. 14
New Drivers
Propelling Semis,
Equipment, IP p. 25
Inside Intel’s New
Innovations p. 14
Multilayer Thickness
Evaluation by
Picosecond
Ultrasonics p. 31
Enterprise 5G
Deployments Gain
Steam p. 20
Accelerating
AI-Defined Cars
DRAM Pricing/DDR5
p. 13
Piezo Dynamic Force
Measurement p. 19
Emerging Vacuum
Challenges p. 23
Semiconductors in
Healthcare p. 22
Precision
Metrology p. 26
Inside Intel’s 3D Quad
Level Cell NAND p. 21
Adopting PUF to
Implement Zero Trust
Architecture p.24
How Chip Technology
Will Decipher Brain
Diseases p. 23
Mid-Infrared
Optical Metrology
PAGE 9
Panel-Level
Heterogeneous
Integration for Analog
ICs p. 16
China Worries
Mount p. 11
Automating Mask SEM
Analysis Using Digital
Twins p. 18
The Future of
Compute p. 27
Ultrasound
Overcomes Trickiest
Internal Defects p. 18
AUGUST/SEPTEMBER 2021
JUNE/JULY 2021
Mitigation of
Pattern Collapse
FOR HIGH ASPECT RATIO HOLES PAGE 16
OCTOBER 2021
Video Compression on
Display Interfaces p. 20
In-Line
Airborne
Quantum-Devices in
an Industrial Process
Flow p. 24
PARTICLE SENSING PAGE 12
Maximizing Protection
of Flip Chip
Interconnects p. 28
Support for Trusted
Chip Manufacturing
Needed p. 25
NOVEMBER 2021
Edge AI
Computing
Advancements
The Time is Now:
Sustainable
Semiconductor
Manufacturing p. 16
FOR AUTONOMOUS VEHICLES PAGE 15
Stepping up to a
New Hybrid AMHS
Design p. 30
IEDM Preview p. 20
Picosecond
Ultrasonics for
Epitaxial Silicon p. 27
System Technology
Automotive
Reliability:
CO-OPTIMIZATION PAGE 16 AND 18
IN EUV LITHOGRAPHY PAGE 11
ZVEI ROBUSTNESS VALIDATION PROCESS PAGE 12
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SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
DECEMBER 2021
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
JANUARY/FEBRUARY 2022
Semiconductor
Materials to
Systems p. 20
Ferroelectric Devices
Forge Ahead p. 19
Magnetic Domain Wall
Devices Move Closer to
Industrial Reality p. 22
Enabling Glass in a
300mm Si Line for
Layer Transfer p. 26
CONTINUED GROWTH PAGE 14
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APRIL/MAY 2022
Next Steps to Reshore
Semiconductor
Manufacturing p. 17
Intel ‘Has a Shot’
at Performance
Leadership p. 14
Solid Film Lithography
Aperture Masks: A
Cleaner Option p. 23
Enhancing
Performance,
Quality and Yield
in Displays p. 16
Improve Throughput
and Yield Through
Digital Transformation
Meeting Reliability
Requirements
of Automotive
Electronics p.28
Executive Outlooks
for 2022 p. 52
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MARCH 2022
2022 FORECAST:
Devices for a New Era
of Electronics p. 25
Survey: Understanding
the Data-Centric
Era p . 31
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SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
JUNE 2022
Overcoming the
EUV Fab Dilemma of
Stochastics p. 18
CHIPS and FABS Acts:
The Road Ahead p. 22
What the Metaverse
Means for Memory p. 20
The Democratization
of Chip Design p. 33
Why Fabs Need a New
Breed of MES p. 24, 26, 29
A Holistic Approach
to Strengthening the
Semiconductor Supply
Chain p. 37
ALD Gains Traction
in MtM Device
Production p. 20
Six Steps to Realign
Semiconductor Supply
Chains p. 24
AUGUST/SEPTEMBER 2022
Scaling Progress Takes
Many Paths p. 19
Achieving Carbon
Neutrality
through Predictive
Maintenance p. 18
Beyond Semiconductor
Packaging Materials:
Advanced Silicone
Solutions p. 21
p. 25
Getting Through the
Semiconductor Supply
Chain Crisis p. 29
JULY 2022
SEMI’s S23 Standard
— Save Energy, Save
Money, Save the
Planet p. 14
Innovations in Pressure
Regulators p. 32
Highlights from VLSI
Symposium p. 28
EMERGING METROLOGY REQUIREMENTS FOR
HETEROGENEOUS INTEGRATION
AND 3D PACKAGING
PAGE 14
SUB-FAB IMPROVEMENTS REQUIRE RELIABLE
How Integrated
Materials Solutions
CIRCUITENHANCE
EDITTIME-TO-MARKET
SOLUTIONS
PAGE 13
REAL-TIME AND HIGH
SENSITIVITY IN-SITU DATA
SPEED INNOVATION PAGE 14
SMART MOBILITY
DEPLOYING R2R STRATEGY WITH DEEP LEARNING MODEL IN
HIGH-MIX SEMICONDUCTOR
MANUFACTURING
PAGE 11
TO DRIVE INDUSTRY’S GROWTH PAGE 15
PAGE 9
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SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
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SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
NOVEMBER/DECEMBER 2022
OCTOBER 2022
JANUARY/FEBRUARY 2023
Improving Fab
Throughput and
Sustainability p. 19
A New Spin on Spatial
ALD Metrology p. 14
Economics in a Post
Moore’s Law Era p. 18
Leveraging AI/ML to
Increase Capacity p. 36
MARCH 2023
High-End Performance
Packaging p. 16
Isotope-Controlled
SiC for Solid-State
Quantum Devices p. 24
Conquering the Next
Hilltop in Logic p. 25
IEDM Preview p. 27
p. 28
A Guide to Using
Robotics p. 19
Unlocking SystemScaling Bottlenecks
with STCO p. 24
CHIPS and Science
Act 2022
Executive Viewpoints
Testing Semiconductors
with 5nm and Smaller
Geometries p. 20
A New Interposer
Design p. 14
Carbon Capture,
Utilization, and Storage
Technology p. 28
Inside the World’s
Smallest Pixel for
Smartphones p. 19
Automation
Considerations
p. 13
2023 Outlook:
p. 24, 28, 31, 48
Process Technology:
Bringing Innovation to
Heating and Power p. 12
Hydrogen Recovery in
EUV Lithography p. 23
in Front-End Wafer Processing
Evaluating STT-MRAM
Chips for Automotive
Applications p. 43
p. 30, 32, 33, 36
Leveraging the
CHIPS Act
to Increase Supply Chain Resilience
p. 12
Measuring the
Critical W-recess in
3D NAND p. 31
Solutions to Chip
Supply Chain Challenges
How AI Can Shrink Chip
Process Development
Time p. 29
U.S. Chip Resurgence
through Whole-of-Nation Collaboration
p. 10
Energy Crisis and
Supply Chain Disruption:
How Global Events are Reshaping the Industry p. 16
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OCTOBER 2023
AUGUST/SEPTEMBER 2023
GaN Power
Semiconductor
Market p. 23
NOVEMBER/DECEMBER 2023
Industry 4.0 Metaverse
Unlocked p. 20
2024 Outlook: Executive
Viewpoints p. 16
AI Optical Processing
Technologies Extend
Moore’s Law p.22
Making AI/ML
Dependable p. 29
The Electronic Properties
p. 36 and 39
of Power Devices
Energy Efficiency in Semiconductor
Manufacturing Fabs
p. 16
The Shape of
Tomorrow’s
Semiconductor
Technology p. 15
Chaos, AI and
AMHS p. 25
Automotive
Electrification
Movement p. 27
U.S. Manufacturing
Gets a $27B Boost
p. 15
p. 17
Improved Precision
Using Piezo Systems
Preview: 2024
Symposium on VLSI
Technology p. 22
p. 24
How to Protect Against
How Machine
Learning Is
Improving
Semiconductor
Operations p. 17
Curvilinear
Technology: A Game
Changer p. 23
Technology for
AI Device
Packaging p. 28
Navigating Semiconductor
MANUFACTURING COMPLEXIT Y WITH
DATA-DRIVEN INSIGHT PAGE 13
p. 17
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APRIL/ MAY 2025
SiC and GaN:
Superior
Alternatives for
Power Devices p. 27
Flexible
Manufacturing
Adoption Boosts
Sustainability p. 30
Emerging Security
Standards p. 19
Safeguarding AI
Applications p. 21
Thermoplastic Pipe
Stress Analysis p. 23
Coriolis Flow
Meters p. 27
p. 18
Building the Future
Predictability for Semiconductor Capital Projects p. 13
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
Bringing AI
TO OPTICAL INSPECTION PAGE 11
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NOVEMBER/DECEMBER 2025
OCTOBER 2025
SEPTEMBER 2025
Why Molybdenum
Is the Precursor of
the Future p. 26
Rigorous Analysis
of Through Glass
Vias p. 27
Revolutionizing
Compound
Semiconductor
Manufacturing p. 29
Creating a
Thriving Chemical
Semiconductor
Supply Chain p. 32
Lowering the
Environmental
Cost of Next-gen
Chips p. 32
Atomic-Level
Cleanliness
in ALD p.37
The $7 Trillion AI
Supercycle p. 18
Scaling TSVs for
High-Performance
Integration p. 31
Trends in Smart
Industrial
Automation p. 33
AI and ML in
Semiconductor
Testing p. 40
AI-Powered
Majorana 1:
Harnessing the Power of
AI in Semiconductor
Manufacturing
JULY/AUGUST 2025
Who Will Pay
for Leading
Edge R&D? p. 33
CORRELATIVE MICROSCOPY PAGE 14
A NEW QUANTUM CHIP PAGE 9
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The Role of
Advanced Sensors
in the Evolution
of Semiconductor
Manufacturing p. 24
p. 30
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JUNE 2025
Asymmetric Power
Biasing for Plasma
Processes p. 17
JANUARY/FEBRUARY 2025
Tackling Networkon-Chip Scaling
Challenges
with STCO p. 18
Spotlight on Ultrapure
Water Generation
Chiplets Gaining
Attention p. 30
Power
Semiconductors p. 33
SEMICONDUCTORS | AI | DESIGN | PACKAGING | MEMS | DISPLAYS
A New Focus on
Energy Efficiency of
Logic ICs p. 15
Palladium-Coated Cu
Wires p. 26
Will HBM Redefine
What’s Possible With
AI? p. 28
Advancing Smart
Cities p. 28
ESD Events
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MARCH 2025
Unlocking the Value
of Digital Twins p. 13
Q&A with Dr. Laura
Matz, CEO of Athinia
CMOS 2.0
Challenges p. 23
More Intuitive
X-Ray Inspection
Software
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p. 22
p. 13
p. 17
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Keeping Pace
Through Industry
Collaboration p. 21
The Memory
Power Wall p. 26
SEMI E187 and E188 p. 33
Electricity for the Fab
IEDM 2023 Preview p. 24
Optimizing
Semiconductor
Manufacturing
Operations p. 31
Optimizing HVAC
Semiconductor Industry 2023
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APRIL/MAY 2024
MARCH 2024
JANUARY/FEBRUARY 2024
Resilient Inventory
Management p. 31
How Power-Thru
Technology Enables
Improved Power
Modules p. 23
Monolithic Magnetic
Sensors Manufactured
by Selective Laser
Annealing p. 26
The State of the
p. 13
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Towards a Process
Flow for Monolithic
CFET Transistor
Architectures p. 20
JULY 2023
Why Hiring Military
Veterans Is a Good
Idea p. 20
MRAM: The Answer
to Automotive
Electronics’
Demands p. 27
The Connected Future
of Agriculture p. 21
FeRAM Interest Grows
Leveraging Low-Power
AI/ML p. 34
JUNE 2023
APRIL/MAY 2023
Yield Prediction and
Smart Product
Routing Using Deep
Learning p. 16
A New Approach to
Lithography FocusExposure Control p. 20
Taking Aim at Subfab
Reliability p. 22
How Real-Time Data
Can Optimize Fabs p. 20
Curvilinear EUV
HOW WE CAN REDUCE ENVIRONMENTAL IMPACT IN
Chip Manufacturing
PAGE 14
MASK PROCESS CORRECTION PAGE 21
MANAGING THE
Thermal Loop
PAGE 22
Lasers Illuminate
THE ROADMAP FOR ADVANCED PACKAGING PAGE 27
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